Epoxy resin composition for semiconductor encapsulation



The invention discloses an epoxy resin composition for semiconductor encapsulation. The epoxy resin composition comprises ferrite magnetic powder, epoxy resin, phenolic resin, a catalyst, carbon black and flame retardant. The epoxy resin composition is applied to the encapsulation operation of semiconductors; the ferrite magnetic powder is used as a filling material, and the ferrite magnetic powder has high magnetic permeability, so that the magnitude of the output U0 in a circuit is obviously reduced together with the increment of signal frequency under the condition that the magnitude of the input Ui is not changed, self-excited high frequency oscillation (parasitic oscillation) is effectively inhibited, the ferrite magnetic powder plays a good role in resisting high frequency interference to the semiconductor circuit, stability and reliability of signal transmission are ensured, and puzzles are solved for users.




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