Epoxy resin composition for semiconductor encapsulation

半导体封装用环氧树脂组合物

Abstract

The invention discloses an epoxy resin composition for semiconductor encapsulation. The epoxy resin composition comprises ferrite magnetic powder, epoxy resin, phenolic resin, a catalyst, carbon black and flame retardant. The epoxy resin composition is applied to the encapsulation operation of semiconductors; the ferrite magnetic powder is used as a filling material, and the ferrite magnetic powder has high magnetic permeability, so that the magnitude of the output U0 in a circuit is obviously reduced together with the increment of signal frequency under the condition that the magnitude of the input Ui is not changed, self-excited high frequency oscillation (parasitic oscillation) is effectively inhibited, the ferrite magnetic powder plays a good role in resisting high frequency interference to the semiconductor circuit, stability and reliability of signal transmission are ensured, and puzzles are solved for users.
本发明公开一种半导体封装用环氧树脂组合物,其包括有铁氧体磁粉、环氧树脂、酚醛树脂、催化剂、碳黑和阻燃剂;藉此,本发明应用于半导体的封装作业中,其采用铁氧体磁粉作为填充料,利用铁氧体磁粉具有较高导磁率的特性,使得在输入Ui大小不变的条件下,电路中的输出U0的大小随着信号频率的增加而明显降低,从而有效抑制自激高频振荡(寄生振荡),对半导体电路起到很好的抗高频干扰作用,保证了信号传输的稳定性和可靠性,为用户解决困扰。

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Patent Citations (5)

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